Thermally conductive adhesive for heat sinks TermoGlue 10g

PRICE IS FOR 1 pc.

AG TermoGlue thermally conductive adhesive is used for fixing heat sinks placed on memory bones, transistors or bridges, among other things. It is an excellent way to create permanent connections. Thanks to the use of the adhesive, excellent thermal conductivity parameters are achieved. Another application is the bonding and filling of gaps between heating elements. When doing so, it is worth remembering not to exceed the maximum thickness, which is 6 mm. It takes approximately 24 hours for the thermally conductive white adhesive to dry.

Capacity 10g

• Colour white
• Surface drying time [25°C, min] 2 - 8
• Hardness 45 - 75
• Tensile strength ( Mpa ) 2.0
• Elongation ( % ) 100
• Thermal conductivity ( W/mk ) >1.0
• Resistance ( c-in/W ) < 2.0 x 1015
• Dielectric strength ( KV/mm ) 20
• Dielectric constant 3.0
• Dielectric loss factor ( 60 Hz ) 0.002
• Operating temperature ( max ) 200oC