Thermally conductive adhesive for Heatsinks TermoGlue 10g

PRICE APPLIES TO 1 pc.

AG TermoGlue thermally conductive adhesive is used to fix heatsinks placed m.in on memory bones, transistors or bridges. It's a great way to create lasting connections. Thanks to the use of glue, excellent thermal conduction parameters are obtained. Another application is to connect and fill the gaps between the heating elements. It is worth remembering not to exceed the maximum thickness, which is 6 mm. It takes about 24 hours for the thermally conductive adhesive of white color to dry.

Capacity 10g

• White
• Surface drying time [25°C, min] 2 - 8
• Hardness 45 - 75
• Tensile strength ( Mpa ) 2.0
• Elongation ( % ) 100
• Thermal conductivity ( W/mk ) >1.0
• Resistance ( c-in/W ) < 2.0 x 1015
• Dielectric strength ( KV/mm ) 20
• Dielectric Constant 3.0
• Coefficient of dielectric losses ( 60 Hz ) 0.002
• Operating temperature (max) 200oC